| Heat dissipation approach in chip on board assembly by using stacked copper Microvias | |
| SHEN, ZUOWEI; FUKUCHI, KYLE; BEAUCHEMIN, MELANIE; URATA, RYOHEI | |
| 2018-03-13 | |
| 著作权人 | GOOGLE LLC |
| 专利号 | US9918377 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Heat dissipation approach in chip on board assembly by using stacked copper Microvias |
| 英文摘要 | The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel. |
| 公开日期 | 2018-03-13 |
| 申请日期 | 2017-04-04 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/32341]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GOOGLE LLC |
| 推荐引用方式 GB/T 7714 | SHEN, ZUOWEI,FUKUCHI, KYLE,BEAUCHEMIN, MELANIE,et al. Heat dissipation approach in chip on board assembly by using stacked copper Microvias. US9918377. 2018-03-13. |
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