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	A method of assembling vcsel chips on a sub mount
	PRUIJMBOOM ARMAND; DUMOULIN RAIMOND LOUIS; MILLER MICHAEL
	2019-10-24
著作权人	KONINKLIJKE PHILIPS N.V.
专利号	IN323584B
国家	印度
文献子类	授权发明
其他题名	A method of assembling vcsel chips on a sub mount
英文摘要	The present invention relates to a method of assembling VCSEL chips (1) on a sub mount (2). A de wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub mount (2). A further de wetting layer (13) is deposited on a connecting side of the sub mount (2) which is to be connected to the VCSEL chips (1). The de wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub mount (2) and the VCSEL chips (1). A solder (15) is applied to the connecting areas (21) of at least one of the two connecting sides. The VCSEL chips (1) are placed on the sub mount (2) and soldered to the sub mount (2) to electrically and mechanically connect the VCSEL chips (1) and the sub mount (2). With the proposed method a high alignment accuracy of the VCSEL chips (1) on the sub mount (2) is achieved without time consuming measures.
公开日期	2019-10-24
申请日期	2014-03-26
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/32165]
专题	半导体激光器专利数据库
作者单位	KONINKLIJKE PHILIPS N.V.
推荐引用方式 GB/T 7714	PRUIJMBOOM ARMAND,DUMOULIN RAIMOND LOUIS,MILLER MICHAEL. A method of assembling vcsel chips on a sub mount. IN323584B. 2019-10-24.

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