Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper

doi:10.1016/j.mechmat.2019.103207

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	Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper
	Liu Y(刘瑶); Cai SL(蔡松林); Su MY(苏明耀); Wang YJ(王云江); Dai LH(戴兰宏)
刊名	MECHANICS OF MATERIALS
	2019-12-01
卷号	139 页码:UNSP 103207
关键词	Hierarchical microstructure Yield function Partial recrystallization Metallic material Mechanical property
ISSN号	0167-6636
DOI	10.1016/j.mechmat.2019.103207
英文摘要	Hierarchical microstructure in partial recrystallized materials can simultaneously improve the strength and ductility of metallic materials. Modeling the mechanical behavior of partial recrystallized materials helps to process materials with superior combination of ductility and strength. Here, using experimental characterization, cellular automation (CA) and finite element method, hierarchical-microstructure based modeling was proposed to simulate the tensile deformation of partial recrystallized copper. Firstly, partial recrystallized coppers with different volume fractions of recrystallization were produced by means of extrusion machining and subsequent heat treatment (HT). Uniaxial tensile tests and microstructural observations show that the hierarchical-microstructure of recrystallized grains (RGs) surrounded by elongated subgrains has a significant effect on the mechanical properties. Then, based on the experimental results, a hierarchical-microstructure based plasticity model was developed to describe the yield surface of partial recrystallized materials. CA was further employed to simulate the hierarchical microstructure. By embedding the plasticity model and simulated hierarchical-microstructure in finite element method, a finite element model (FEM) for mechanical behavior of partial recrystallized copper was proposed, where the elongated subgrain with forest dislocation and low angle grain boundary, the RG with few dislocations and twin boundary, and volume fraction of recrystallization were taken into consideration. Finally, the experimental data and the comparison with the conventional plasticity model validate the rationality of the proposed model.
分类号	二类/Q1
WOS关键词	CELLULAR-AUTOMATON SIMULATION ; DYNAMIC RECRYSTALLIZATION ; MECHANICAL-PROPERTIES ; DISLOCATION DENSITY ; CONSTITUTIVE MODEL ; DUCTILITY ; STRENGTH ; STRAIN ; GROWTH ; FLOW
WOS研究方向	Materials Science, Multidisciplinary ; Mechanics
语种	英语
WOS记录号	WOS:000498756500015
其他责任者	Cai, SL (reprint author), ; Dai, LH (reprint author)
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/80787]
专题	力学研究所_非线性力学国家重点实验室
作者单位	1.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 101408, Peoples R China 2.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China 3.China Elect Power Res Inst, Beijing 100192, Peoples R China 4.Univ Sci & Technol Beijing, Sch Math & Phys, Beijing 100083, Peoples R China
推荐引用方式 GB/T 7714	Liu Y,Cai SL,Su MY,et al. Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper[J]. MECHANICS OF MATERIALS,2019,139:UNSP 103207.
APA	刘瑶,蔡松林,苏明耀,王云江,&戴兰宏.(2019).Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper.MECHANICS OF MATERIALS,139,UNSP 103207.
MLA	刘瑶,et al."Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper".MECHANICS OF MATERIALS 139(2019):UNSP 103207.