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	Molecular dynamics simulation of the role of dislocations in microcrack healing
	Li C(李琛); Gao KW(高克玮); Qiao LJ(乔利杰); Chu WY(褚武扬); Zhou FX(周富信)
刊名	Acta Mechanica Sinica
	2000
卷号	16期号:4页码:366-373
ISSN号	0567-7718
通讯作者	Li, S (reprint author), Univ Sci & Technol Beijing, Dept Mat Phys, Beijing 100083, Peoples R China.
中文摘要	The molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress. A centre microcrack in Cu crystal would be sealed under compressive stress or by heating. The role of compressive stress and heating in crack healing was additive. During microcrack healing, dislocation generation and motion occurred. When there were pre-existing dislocations around the microcrack, the critical temperature or compressive stress necessary for microcrack healing would decrease, and, the higher the number of dislocations, the lower the critical temperature or compressive stress. The critical temperature necessary for microcrack healing depended upon the orientation of the crack plane. For example, the critical temperature for the crack along the (001) plane was the lowest, i.e. 770K.
学科主题	力学
类目[WOS]	Engineering, Mechanical ; Mechanics
研究领域[WOS]	Engineering ; Mechanics
关键词[WOS]	THIN-CRYSTALS ; CRACK-TIP ; NUCLEATION ; METALS
收录类别	SCI ; EI ; CSCD
语种	英语
WOS记录号	WOS:000165633700008
公开日期	2007-06-15 ; 2007-12-05 ; 2009-06-23
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/15841]
专题	力学研究所_力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Li C,Gao KW,Qiao LJ,et al. Molecular dynamics simulation of the role of dislocations in microcrack healing[J]. Acta Mechanica Sinica,2000,16(4):366-373.
APA	李琛,高克玮,乔利杰,褚武扬,&周富信.(2000).Molecular dynamics simulation of the role of dislocations in microcrack healing.Acta Mechanica Sinica,16(4),366-373.
MLA	李琛,et al."Molecular dynamics simulation of the role of dislocations in microcrack healing".Acta Mechanica Sinica 16.4(2000):366-373.

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