| Block Compressive Sensing for Solder Joint Images With Wavelet Packet Thresholding | |
| Zhao, Hui-Huang*; Rosin, Paul L.; Lai, Yu-Kun | |
| 刊名 | IEEE Transactions on Components, Packaging and Manufacturing Technology
 |
| 2019 | |
| 卷号 | 9期号:6页码:1190-1199 |
| 关键词 | Block compressive sensing (CS) compressive sampling patching pursuit greedy basis pursuit orthogonal matching pursuit solder joint image subspace pursuit wavelet packet thresholding |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2019.2907106 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000470984600022 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5285798 |
| 专题 | 衡阳师范学院 |
| 作者单位 | [Zhao, Hui-Huang] Hengyang Normal Univ, Coll Comp Sci & Technol, Dept Comp Sci, Hengyang 421002, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhao, Hui-Huang*,Rosin, Paul L.,Lai, Yu-Kun. Block Compressive Sensing for Solder Joint Images With Wavelet Packet Thresholding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2019,9(6):1190-1199. |
| APA | Zhao, Hui-Huang*,Rosin, Paul L.,&Lai, Yu-Kun.(2019).Block Compressive Sensing for Solder Joint Images With Wavelet Packet Thresholding.IEEE Transactions on Components, Packaging and Manufacturing Technology,9(6),1190-1199. |
| MLA | Zhao, Hui-Huang*,et al."Block Compressive Sensing for Solder Joint Images With Wavelet Packet Thresholding".IEEE Transactions on Components, Packaging and Manufacturing Technology 9.6(2019):1190-1199. |
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