| Research on BGA Solder Joint Two-dimensional Quality Information Extraction | |
| Zhao Huihuang*; Wang Yaonan; Sun Yaqi | |
| 2012 | |
| 会议名称 | 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) |
| 会议日期 | AUG 13-16, 2012 |
| 会议地点 | Guilin, PEOPLES R CHINA |
| 页码 | 1285-1287 |
| 会议录 | 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)
 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000319836000279 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5283285 |
| 专题 | 衡阳师范学院 |
| 作者单位 | [Zhao Huihuang] Hengyang Normal Univ, Dept Comp Sci, Hengyang 421008, Hunan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhao Huihuang*,Wang Yaonan,Sun Yaqi. Research on BGA Solder Joint Two-dimensional Quality Information Extraction[C]. 见:13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP). Guilin, PEOPLES R CHINA. AUG 13-16, 2012. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论