An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method | |
Yang, Qing; Yuan, Yirang | |
刊名 | APPLIED NUMERICAL MATHEMATICS
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2013 | |
卷号 | 70页码:42-57 |
关键词 | Semiconductor device of heat conduction Mixed finite element method Characteristics-mixed finite element method Post-processing step Error estimates |
DOI | 10.1016/j.apnum.2013.02.005 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5177096 |
专题 | 山东大学 |
作者单位 | 1.Shandong Normal Univ, Sch Math Sci, Jinan 250014, Peoples R China. 2.Shandong Univ, Inst Math, Jinan 250100, Peoples R Ch |
推荐引用方式 GB/T 7714 | Yang, Qing,Yuan, Yirang. An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method[J]. APPLIED NUMERICAL MATHEMATICS,2013,70:42-57. |
APA | Yang, Qing,&Yuan, Yirang.(2013).An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method.APPLIED NUMERICAL MATHEMATICS,70,42-57. |
MLA | Yang, Qing,et al."An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method".APPLIED NUMERICAL MATHEMATICS 70(2013):42-57. |
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