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	An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method
	Yang, Qing; Yuan, Yirang
刊名	APPLIED NUMERICAL MATHEMATICS
	2013
卷号	70页码:42-57
关键词	Semiconductor device of heat conduction Mixed finite element method Characteristics-mixed finite element method Post-processing step Error estimates
DOI	10.1016/j.apnum.2013.02.005
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5177096
专题	山东大学
作者单位	1.Shandong Normal Univ, Sch Math Sci, Jinan 250014, Peoples R China. 2.Shandong Univ, Inst Math, Jinan 250100, Peoples R Ch
推荐引用方式 GB/T 7714	Yang, Qing,Yuan, Yirang. An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method[J]. APPLIED NUMERICAL MATHEMATICS,2013,70:42-57.
APA	Yang, Qing,&Yuan, Yirang.(2013).An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method.APPLIED NUMERICAL MATHEMATICS,70,42-57.
MLA	Yang, Qing,et al."An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method".APPLIED NUMERICAL MATHEMATICS 70(2013):42-57.

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