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	INVESTIGATION OF Ta/Ni-Al INTEGRATED FILM USED AS A DIFFUSION BARRIER LAYER BETWEEN Cu AND Si
	Yang, Lim[1]; Wang, Shi Jie[2]; Huo, Ji Chuan[3]; Li, Xiao Hong[4]; Guo, Jian Xin[5]; Dai, Xiu Hong[6]; Ma, Lian Xi[7]; Zhang, Xiang Yi[8]; Liu, Bao Ting[9]
刊名	SURFACE REVIEW AND LETTERS
	2014
卷号	21期号:6
关键词	Diffusion barrier Cu interconnect amorphous Ni-Al Ta thin film sputtering
ISSN号	0218-625X
DOI	http://dx.doi.org/10.1142/S0218625X14500796
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5079758
专题	河北大学
作者单位	1.[1]Hebei Univ, Hebei Prov Key Lab Optoelect Informat Mat, Baoding 071002, Hebei, Peoples R China.,Hebei Univ, Coll Phys Sci & Technol, Baoding 071002, Hebei, Peoples R China. 2.[2]Hebei Univ, Hebei Prov Key Lab Optoelect Informat Mat, Baoding 071002, Hebei, Peoples R China.,Hebei Univ, Coll Phys Sci & Technol, Baoding 071002, Hebei, Peoples R China. 3.[3]Hebei Univ, Hebei Prov Key Lab Optoelect Informat Mat, Baoding 071002, Hebei, Peoples R China.,Hebei Univ, Coll Phys Sci & Technol, Baoding 071002, Hebei, Peoples R China. 4.[4]Hebei Univ, Hebei Prov Key Lab Optoelect Informat Mat, Baoding 071002, Hebei, Peoples R China.,Hebei Univ, Coll Phys Sci & Technol, Baoding 071002, Hebei, Peoples R China. 5.[5]Hebei Univ, Hebei Prov Key Lab Optoelect Informat Mat, Baoding 071002, Hebei, Peoples R China.,Hebei Univ, Coll Phys Sci & Technol, Baoding 071002, Hebei, Peoples R China. 6.[6]Hebei Univ, Hebei Prov Key Lab Optoelect Informat Mat, Baoding 071002, Hebei, Peoples R China.,Hebei Univ, Coll Phys Sci & Technol, Baoding 071002, Hebei, Peoples R China. 7.[7]Blinn Coll, Dept Phys, Bryan, TX 77805 USA. 8.[8]Yanshan Univ, State Key Lab Metastable Mat Sci & Technol, Qinhuangdao 066004, Hebei, Peoples R China. 9.[9]Hebei Univ, Hebei Prov Key Lab Optoelect Informat Mat, Baoding 071002, Hebei, Peoples R China.,Hebei Univ, Coll Phys Sci & Technol, Baoding 071002, Hebei, Peoples R China.
推荐引用方式 GB/T 7714	Yang, Lim[1],Wang, Shi Jie[2],Huo, Ji Chuan[3],et al. INVESTIGATION OF Ta/Ni-Al INTEGRATED FILM USED AS A DIFFUSION BARRIER LAYER BETWEEN Cu AND Si[J]. SURFACE REVIEW AND LETTERS,2014,21(6).
APA	Yang, Lim[1].,Wang, Shi Jie[2].,Huo, Ji Chuan[3].,Li, Xiao Hong[4].,Guo, Jian Xin[5].,...&Liu, Bao Ting[9].(2014).INVESTIGATION OF Ta/Ni-Al INTEGRATED FILM USED AS A DIFFUSION BARRIER LAYER BETWEEN Cu AND Si.SURFACE REVIEW AND LETTERS,21(6).
MLA	Yang, Lim[1],et al."INVESTIGATION OF Ta/Ni-Al INTEGRATED FILM USED AS A DIFFUSION BARRIER LAYER BETWEEN Cu AND Si".SURFACE REVIEW AND LETTERS 21.6(2014).

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