| Simple and accurate inductance model of 3D inductor based on TSV | |
| Wang, Fengjuan; Yu, Ningmei | |
| 2016 | |
| 卷号 | 52页码:1815-1816 |
| 关键词 | three-dimensional integrated circuits inductors solenoids finite element analysis integrated circuit modelling on-chip inductors integrated circuit application through-silicon via TSV 3D inductor solenoid architecture finite element method |
| ISSN号 | 0013-5194 |
| DOI | 10.1049/el.2016.2241 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000385960800044 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4985295 |
| 专题 | 西安理工大学 |
| 推荐引用方式 GB/T 7714 | Wang, Fengjuan,Yu, Ningmei. Simple and accurate inductance model of 3D inductor based on TSV[J],2016,52:1815-1816. |
| APA | Wang, Fengjuan,&Yu, Ningmei.(2016).Simple and accurate inductance model of 3D inductor based on TSV.,52,1815-1816. |
| MLA | Wang, Fengjuan,et al."Simple and accurate inductance model of 3D inductor based on TSV".52(2016):1815-1816. |
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