| A novel overlay process for imprint lithography using load release and alignment error pre-compensation method | |
| Shao, Jinyou; Ding, Yucheng; Tang, Yiping; Liu, Hongzhong; Lu, Bingheng; Cui, Dongyin | |
| 2008 | |
| 关键词 | imprint lithography pre-compensation load release alignment overlay |
| 卷号 | 85 |
| 期号 | 1 |
| DOI | 10.1016/j.mee.2007.05.004 |
| 页码 | 168-174 |
| 会议录 | MICROELECTRONIC ENGINEERING
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| URL标识 | 查看原文 |
| ISSN号 | 0167-9317 |
| WOS记录号 | WOS:000253030100030 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4866114 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Shao, Jinyou,Ding, Yucheng,Tang, Yiping,et al. A novel overlay process for imprint lithography using load release and alignment error pre-compensation method[C]. 见:. |
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