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	Molecular dynamics simulation of diffusion behavior for thermalplastic fusion bonding
	Sun, Yibo; Luo, Yi; Wang, Xiaodong; Feng, Yuqi
	2011
会议名称	1st International Conference on High Performance Structures and Materials Engineering
会议日期	2011-05-05
会议地点	Beijing, PEOPLES R CHINA
关键词	MEMS Fusion bonding Molecular Dynamics Diffusion
页码	45-+
会议录	1st International Conference on High Performance Structures and Materials Engineering
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4842415
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian, Peoples R China. 2.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Provin, Dalian, Peoples R China.
推荐引用方式 GB/T 7714	Sun, Yibo,Luo, Yi,Wang, Xiaodong,et al. Molecular dynamics simulation of diffusion behavior for thermalplastic fusion bonding[C]. 见:1st International Conference on High Performance Structures and Materials Engineering. Beijing, PEOPLES R CHINA. 2011-05-05.

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