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	An Image-Based Microscale Simulation of Thermal Residual Stresses in DSE Oxide Ceramic Composite
	Sha, J. J.; Ochiai, S.; Okuda, H.; Iwamoto, S.; Morishita, K.; Waku, Y.; Nakagawa, N.; Mitani, A.; Ishikawa, T.; Sato, M.
	2011
会议名称	2nd International Conference on Manufacturing Science and Engineering
会议日期	2011-04-09
会议地点	Guilin, PEOPLES R CHINA
关键词	Thermal residual stress FEM simulation DSE ceramic composite
页码	1681-+
会议录	2nd International Conference on Manufacturing Science and Engineering
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4841767
专题	大连理工大学
作者单位	1.Dalian Univ Technol, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Liaoning, Peoples R China. 2.Kyoto Univ, Dept Mat Sci & Engn, Sakyo Ku, Kyoto 6068501, Japan. 3.Ube Ind Ltd, Ube, Yamaguchi 7558633, Japan.
推荐引用方式 GB/T 7714	Sha, J. J.,Ochiai, S.,Okuda, H.,et al. An Image-Based Microscale Simulation of Thermal Residual Stresses in DSE Oxide Ceramic Composite[C]. 见:2nd International Conference on Manufacturing Science and Engineering. Guilin, PEOPLES R CHINA. 2011-04-09.

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