Non-contact conductive detection microchip manufacturing method, involves performing plasma surface modification process, and lightly bonding slide glass and microchannel according to proportion to obtain microchip. | |
DU L LIU C LIU J WANG L XU F XU Z | |
2012 | |
公开日期 | 2012-08-22 |
URL标识 | 查看原文 |
申请日期 | 2012-05-02 |
内容类型 | 专利 |
URI标识 | http://www.corc.org.cn/handle/1471x/4814332 |
专题 | 大连理工大学 |
作者单位 | UNIV DALIAN TECHNOLOGY (UYDA-C |
推荐引用方式 GB/T 7714 | DU L LIU C LIU J WANG L XU F XU Z. Non-contact conductive detection microchip manufacturing method, involves performing plasma surface modification process, and lightly bonding slide glass and microchannel according to proportion to obtain microchip.. 2012-01-01. |
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