Application of silicon stress sensor in flip chip packaging system

	Application of silicon stress sensor in flip chip packaging system
	Jiang, Chengjie ; Xiao, Fei ; Yang, H ; Dou, Chuanguo
刊名	ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
	2011
期号	0 页码:932-936
通讯作者	Jiang, C.(jiangcjI987@gmail.com)
公开日期	2012-08-22
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/109175]
专题	上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式 GB/T 7714	Jiang, Chengjie,Xiao, Fei,Yang, H,et al. Application of silicon stress sensor in flip chip packaging system[J]. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging,2011(0):932-936.
APA	Jiang, Chengjie,Xiao, Fei,Yang, H,&Dou, Chuanguo.(2011).Application of silicon stress sensor in flip chip packaging system.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging(0),932-936.
MLA	Jiang, Chengjie,et al."Application of silicon stress sensor in flip chip packaging system".ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging .0(2011):932-936.