Application of silicon stress sensor in flip chip packaging system | |
Jiang, Chengjie ; Xiao, Fei ; Yang, H ; Dou, Chuanguo | |
刊名 | ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
![]() |
2011 | |
期号 | 0页码:932-936 |
通讯作者 | Jiang, C.(jiangcjI987@gmail.com) |
公开日期 | 2012-08-22 |
内容类型 | 期刊论文 |
源URL | [http://ir.sim.ac.cn/handle/331004/109175] ![]() |
专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
推荐引用方式 GB/T 7714 | Jiang, Chengjie,Xiao, Fei,Yang, H,et al. Application of silicon stress sensor in flip chip packaging system[J]. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging,2011(0):932-936. |
APA | Jiang, Chengjie,Xiao, Fei,Yang, H,&Dou, Chuanguo.(2011).Application of silicon stress sensor in flip chip packaging system.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging(0),932-936. |
MLA | Jiang, Chengjie,et al."Application of silicon stress sensor in flip chip packaging system".ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging .0(2011):932-936. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论