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	Additive-assisted “metal-wire-gap” process for N-type two-dimensional organic crystalline films
	Chengdong Yang; Jun Qian; Qijing Wang; Sai Jiang; Yiwei Duan; Hengyuan Wang; Yun Li
刊名	Organic Electronics
	2019
关键词	Solution-prepared N-type 2D organic crystalline films Metal-wire-gap Additive-assisted Heterogeneous interface
ISSN号	1566-1199
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4736804
专题	湖南大学
作者单位	National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, Jiangsu, 210093, PR China
推荐引用方式 GB/T 7714	Chengdong Yang,Jun Qian,Qijing Wang,et al. Additive-assisted “metal-wire-gap” process for N-type two-dimensional organic crystalline films[J]. Organic Electronics,2019.
APA	Chengdong Yang.,Jun Qian.,Qijing Wang.,Sai Jiang.,Yiwei Duan.,...&Yun Li.(2019).Additive-assisted “metal-wire-gap” process for N-type two-dimensional organic crystalline films.Organic Electronics.
MLA	Chengdong Yang,et al."Additive-assisted “metal-wire-gap” process for N-type two-dimensional organic crystalline films".Organic Electronics (2019).

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