The study of negative thermal expansion and magnetic evolution in antiperovskite compounds Cu0.8-xSnxMn0.2NMn3

	The study of negative thermal expansion and magnetic evolution in antiperovskite compounds Cu0.8-xSnxMn0.2NMn3
	Lin, JC ; Wang, BS ; Lin, S ; Tong, P ; Lu, WJ ; Zhang, L ; Song, WH ; Sun, YP
刊名	journal of applied physics
	2012-02-15
卷号	111 期号:4
学科主题	新型功能材料与固体内耗
公开日期	2012-07-19
内容类型	期刊论文
源URL	[http://ir.hfcas.ac.cn/handle/334002/7714]
专题	合肥物质科学研究院_中科院固体物理研究所
推荐引用方式 GB/T 7714	Lin, JC,Wang, BS,Lin, S,et al. The study of negative thermal expansion and magnetic evolution in antiperovskite compounds Cu0.8-xSnxMn0.2NMn3[J]. journal of applied physics,2012,111(4).
APA	Lin, JC.,Wang, BS.,Lin, S.,Tong, P.,Lu, WJ.,...&Sun, YP.(2012).The study of negative thermal expansion and magnetic evolution in antiperovskite compounds Cu0.8-xSnxMn0.2NMn3.journal of applied physics,111(4).
MLA	Lin, JC,et al."The study of negative thermal expansion and magnetic evolution in antiperovskite compounds Cu0.8-xSnxMn0.2NMn3".journal of applied physics 111.4(2012).