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	Influence of elliptical vibration on the behavior of silicon during nanocutting.
	Dai, Houfu; Du, Hao; Chen, Jianbin; Chen, Genyu
刊名	International Journal of Advanced Manufacturing Technology
	2019
卷号	Vol.102 No.9-12页码:3597-3612
关键词	Elliptical vibration nanocutting Molecular dynamics Phase transformation Subsurface damage
ISSN号	0268-3768
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4609878
专题	湖南大学
作者单位	1.College of Mechanical Engineering, Guizhou University, 550025, Guiyang, China 2.School of Mechanical Engineering and Mechanics, Ningbo University, 315211, Ningbo, People’s Republic of China 3.State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, 410082, Changsha, People’s Republic of China
推荐引用方式 GB/T 7714	Dai, Houfu,Du, Hao,Chen, Jianbin,et al. Influence of elliptical vibration on the behavior of silicon during nanocutting.[J]. International Journal of Advanced Manufacturing Technology,2019,Vol.102 No.9-12:3597-3612.
APA	Dai, Houfu,Du, Hao,Chen, Jianbin,&Chen, Genyu.(2019).Influence of elliptical vibration on the behavior of silicon during nanocutting..International Journal of Advanced Manufacturing Technology,Vol.102 No.9-12,3597-3612.
MLA	Dai, Houfu,et al."Influence of elliptical vibration on the behavior of silicon during nanocutting.".International Journal of Advanced Manufacturing Technology Vol.102 No.9-12(2019):3597-3612.

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