| Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics | |
| Cai-Fu Li; Wanli Li; Hao Zhang; Jinting Jiu; Yang Yang; Lingying Li; Yue Gao; Zhi-Quan Liu; Katsuaki Suganuma | |
| 刊名 | ACS Applied Materials & Interfaces
 |
| 2019 | |
| 卷号 | Vol.11 No.3页码:3231-3240 |
| 关键词 | Ag microflakes conductive pastes recoverability stretchable bonding stretchable wirings |
| ISSN号 | 1944-8244;1944-8252 |
| URL标识 | 查看原文 |
| 公开日期 | [db:dc_date_available] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4605037 |
| 专题 | 湖南大学 |
| 作者单位 | The Institute of Scientific and Industrial Research, Osaka University, Ibaraki 567-0047, Japan Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, Suita 565-0871, Japan § Senju Metal Industry Co., Ltd., Tokyo 120-8555, Japan ∥ Pacific Northwest National Laboratory, Richland, Washington 99354, United States ⊥ Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China |
| 推荐引用方式 GB/T 7714 | Cai-Fu Li,Wanli Li,Hao Zhang,et al. Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics[J]. ACS Applied Materials & Interfaces,2019,Vol.11 No.3:3231-3240. |
| APA | Cai-Fu Li.,Wanli Li.,Hao Zhang.,Jinting Jiu.,Yang Yang.,...&Katsuaki Suganuma.(2019).Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics.ACS Applied Materials & Interfaces,Vol.11 No.3,3231-3240. |
| MLA | Cai-Fu Li,et al."Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics".ACS Applied Materials & Interfaces Vol.11 No.3(2019):3231-3240. |
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