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	Vacuum diffusion bonding TC4 to Ni80Cr20: Interfacial microstructure, segregation, cracking and properties
	Liu, Kun; Li, Yajiang; Wang, Juan
刊名	VACUUM
	2018
卷号	158页码:218-222
关键词	Vacuum diffusion bonding TC4 titanium alloy Segregation Cracking
DOI	10.1016/j.vacuum.2018.10.001
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4582304
专题	山东大学
作者单位	Shandong Univ, Minist Educ, Key Lab Liquid Solid Struct Evolut & Proc Mat, Jinan 250061, Shandong, Peoples R China
推荐引用方式 GB/T 7714	Liu, Kun,Li, Yajiang,Wang, Juan. Vacuum diffusion bonding TC4 to Ni80Cr20: Interfacial microstructure, segregation, cracking and properties[J]. VACUUM,2018,158:218-222.
APA	Liu, Kun,Li, Yajiang,&Wang, Juan.(2018).Vacuum diffusion bonding TC4 to Ni80Cr20: Interfacial microstructure, segregation, cracking and properties.VACUUM,158,218-222.
MLA	Liu, Kun,et al."Vacuum diffusion bonding TC4 to Ni80Cr20: Interfacial microstructure, segregation, cracking and properties".VACUUM 158(2018):218-222.

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