Vacuum diffusion bonding TC4 to Ni80Cr20: Interfacial microstructure, segregation, cracking and properties | |
Liu, Kun; Li, Yajiang; Wang, Juan | |
刊名 | VACUUM
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2018 | |
卷号 | 158页码:218-222 |
关键词 | Vacuum diffusion bonding TC4 titanium alloy Segregation Cracking |
DOI | 10.1016/j.vacuum.2018.10.001 |
URL标识 | 查看原文 |
公开日期 | [db:dc_date_available] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4582304 |
专题 | 山东大学 |
作者单位 | Shandong Univ, Minist Educ, Key Lab Liquid Solid Struct Evolut & Proc Mat, Jinan 250061, Shandong, Peoples R China |
推荐引用方式 GB/T 7714 | Liu, Kun,Li, Yajiang,Wang, Juan. Vacuum diffusion bonding TC4 to Ni80Cr20: Interfacial microstructure, segregation, cracking and properties[J]. VACUUM,2018,158:218-222. |
APA | Liu, Kun,Li, Yajiang,&Wang, Juan.(2018).Vacuum diffusion bonding TC4 to Ni80Cr20: Interfacial microstructure, segregation, cracking and properties.VACUUM,158,218-222. |
MLA | Liu, Kun,et al."Vacuum diffusion bonding TC4 to Ni80Cr20: Interfacial microstructure, segregation, cracking and properties".VACUUM 158(2018):218-222. |
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