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	Interfacial Reactions of Co-electrodeposited Eutectic Au-Sn Solder Bumps on Ni and Cu Substrates
	Huang, Mingling; Zhang, Tongxin; Zhao, Ning; Jiao, Tingting
	2013
会议名称	14th International Conference on Electronic Packaging Technology (ICEPT)
会议日期	2013-08-11
会议地点	Chinese Inst Elect, Dalian, PEOPLES R CHINA
关键词	co-electrodeposition eutectic Au-30at.%Sn solder bumps non-cyanide interfacial reaction
页码	225-228
会议录	14th International Conference on Electronic Packaging Technology (ICEPT)
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4542935
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sci & Engn, Lab Elect Packaging Mat, Dalian, Peoples R China.
推荐引用方式 GB/T 7714	Huang, Mingling,Zhang, Tongxin,Zhao, Ning,et al. Interfacial Reactions of Co-electrodeposited Eutectic Au-Sn Solder Bumps on Ni and Cu Substrates[C]. 见:14th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Dalian, PEOPLES R CHINA. 2013-08-11.

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