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	Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting
	Wen, Shutao; Tan, Yi; Shi, Shuang; Dong, Wei; Jiang, Dachuan; Liao, Jiao; Zhu, Zhi
刊名	INTERNATIONAL JOURNAL OF THERMAL SCIENCES
	2013
卷号	74页码:37-43
关键词	Thermal contact resistance Silicon and copper surfaces Temperature field Computer simulation
ISSN号	1290-0729
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4542086
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116023, Liaoning Provin, Peoples R China. 2.Dalian Univ Technol, Key Lab Solar Energy Photovolta Syst Liaoning Pro, Dalian 116023, Liaoning Provin, Peoples R China. 3.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116023, Liaoning Provin, Peoples R China.
推荐引用方式 GB/T 7714	Wen, Shutao,Tan, Yi,Shi, Shuang,et al. Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting[J]. INTERNATIONAL JOURNAL OF THERMAL SCIENCES,2013,74:37-43.
APA	Wen, Shutao.,Tan, Yi.,Shi, Shuang.,Dong, Wei.,Jiang, Dachuan.,...&Zhu, Zhi.(2013).Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting.INTERNATIONAL JOURNAL OF THERMAL SCIENCES,74,37-43.
MLA	Wen, Shutao,et al."Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting".INTERNATIONAL JOURNAL OF THERMAL SCIENCES 74(2013):37-43.

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