Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting | |
Wen, Shutao; Tan, Yi; Shi, Shuang; Dong, Wei; Jiang, Dachuan; Liao, Jiao; Zhu, Zhi | |
刊名 | INTERNATIONAL JOURNAL OF THERMAL SCIENCES
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2013 | |
卷号 | 74页码:37-43 |
关键词 | Thermal contact resistance Silicon and copper surfaces Temperature field Computer simulation |
ISSN号 | 1290-0729 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4542086 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116023, Liaoning Provin, Peoples R China. 2.Dalian Univ Technol, Key Lab Solar Energy Photovolta Syst Liaoning Pro, Dalian 116023, Liaoning Provin, Peoples R China. 3.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116023, Liaoning Provin, Peoples R China. |
推荐引用方式 GB/T 7714 | Wen, Shutao,Tan, Yi,Shi, Shuang,et al. Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting[J]. INTERNATIONAL JOURNAL OF THERMAL SCIENCES,2013,74:37-43. |
APA | Wen, Shutao.,Tan, Yi.,Shi, Shuang.,Dong, Wei.,Jiang, Dachuan.,...&Zhu, Zhi.(2013).Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting.INTERNATIONAL JOURNAL OF THERMAL SCIENCES,74,37-43. |
MLA | Wen, Shutao,et al."Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting".INTERNATIONAL JOURNAL OF THERMAL SCIENCES 74(2013):37-43. |
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