| STRESS SINGULARITY ANALYSIS OF MULTI-MATERIAL WEDGES UNDER ANTIPLANE DEFORMATION | |
| Hu, Xiaofei; Yao, Weian | |
| 刊名 | ACTA MECHANICA SOLIDA SINICA
 |
| 2013 | |
| 卷号 | 26页码:151-160 |
| 关键词 | analytical method eigenvalues interface crack symplectic space |
| ISSN号 | 0894-9166 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4539276 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Hu, Xiaofei,Yao, Weian. STRESS SINGULARITY ANALYSIS OF MULTI-MATERIAL WEDGES UNDER ANTIPLANE DEFORMATION[J]. ACTA MECHANICA SOLIDA SINICA,2013,26:151-160. |
| APA | Hu, Xiaofei,&Yao, Weian.(2013).STRESS SINGULARITY ANALYSIS OF MULTI-MATERIAL WEDGES UNDER ANTIPLANE DEFORMATION.ACTA MECHANICA SOLIDA SINICA,26,151-160. |
| MLA | Hu, Xiaofei,et al."STRESS SINGULARITY ANALYSIS OF MULTI-MATERIAL WEDGES UNDER ANTIPLANE DEFORMATION".ACTA MECHANICA SOLIDA SINICA 26(2013):151-160. |
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