QQ客服 官方微博 反馈留言

	Using silicon molds for ultrasonic embossing on Polymethyl Methacrylate (PMMA) substrates
	Qi, Na; Luo, Yi; Yan, Xu; Wang, Xiaodong; Wang, Liding
刊名	MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
	2013
卷号	19页码:609-616
ISSN号	0946-7076
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4539135
专题	大连理工大学
作者单位	Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116023, Peoples R China.
推荐引用方式 GB/T 7714	Qi, Na,Luo, Yi,Yan, Xu,et al. Using silicon molds for ultrasonic embossing on Polymethyl Methacrylate (PMMA) substrates[J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,2013,19:609-616.
APA	Qi, Na,Luo, Yi,Yan, Xu,Wang, Xiaodong,&Wang, Liding.(2013).Using silicon molds for ultrasonic embossing on Polymethyl Methacrylate (PMMA) substrates.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,19,609-616.
MLA	Qi, Na,et al."Using silicon molds for ultrasonic embossing on Polymethyl Methacrylate (PMMA) substrates".MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 19(2013):609-616.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。