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	From the grain/workpiece interaction to the coupled thermal-mechanical residual stresses: an integrated modeling for controlled stress grinding of bearing ring raceway
	Wang, Dexiang; Sun, Shufeng; Jiang, Jingliang; Liu, Xinfu
刊名	International Journal of Advanced Manufacturing Technology
	2019
卷号	101期号:1-4页码:475-499
DOI	10.1007/s00170-018-2916-7
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4534310
专题	山东大学
作者单位	School of Mechanical and Automotive Engineering, Qingdao University of Technology, Qingda
推荐引用方式 GB/T 7714	Wang, Dexiang,Sun, Shufeng,Jiang, Jingliang,et al. From the grain/workpiece interaction to the coupled thermal-mechanical residual stresses: an integrated modeling for controlled stress grinding of bearing ring raceway[J]. International Journal of Advanced Manufacturing Technology,2019,101(1-4):475-499.
APA	Wang, Dexiang,Sun, Shufeng,Jiang, Jingliang,&Liu, Xinfu.(2019).From the grain/workpiece interaction to the coupled thermal-mechanical residual stresses: an integrated modeling for controlled stress grinding of bearing ring raceway.International Journal of Advanced Manufacturing Technology,101(1-4),475-499.
MLA	Wang, Dexiang,et al."From the grain/workpiece interaction to the coupled thermal-mechanical residual stresses: an integrated modeling for controlled stress grinding of bearing ring raceway".International Journal of Advanced Manufacturing Technology 101.1-4(2019):475-499.

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