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	Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology
	Xu, Tianhan; Wang, Danghui; Yao, Tingzhen
刊名	Fenmo Yejin Jishu/Powder Metallurgy Technology
	2010
卷号	28期号:[db:dc_citation_issue]
关键词	Alloy superheat Atomization efficiency Lead-free solder powder of Sn-Ag-Cu system Powders properties Protrusion of delivery tube
ISSN号	1001-3784
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4501977
专题	西安交通大学
推荐引用方式 GB/T 7714	Xu, Tianhan,Wang, Danghui,Yao, Tingzhen. Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology[J]. Fenmo Yejin Jishu/Powder Metallurgy Technology,2010,28([db:dc_citation_issue]).
APA	Xu, Tianhan,Wang, Danghui,&Yao, Tingzhen.(2010).Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology.Fenmo Yejin Jishu/Powder Metallurgy Technology,28([db:dc_citation_issue]).
MLA	Xu, Tianhan,et al."Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology".Fenmo Yejin Jishu/Powder Metallurgy Technology 28.[db:dc_citation_issue](2010).

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