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	Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components
	Yan, Yabin; Sumigawa, Takashi; Shang, Fulin; Kitamura, Takayuki
刊名	ENGINEERING FRACTURE MECHANICS
	2011
卷号	78期号:[db:dc_citation_issue]页码:2935-2946
关键词	Residual stress Crack propagation Plasticity Crack initiation Nano-component Interface crack Cohesive zone model Delamination Thin film Nanoscale Interface
ISSN号	0013-7944
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4498904
专题	西安交通大学
推荐引用方式 GB/T 7714	Yan, Yabin,Sumigawa, Takashi,Shang, Fulin,et al. Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components[J]. ENGINEERING FRACTURE MECHANICS,2011,78([db:dc_citation_issue]):2935-2946.
APA	Yan, Yabin,Sumigawa, Takashi,Shang, Fulin,&Kitamura, Takayuki.(2011).Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components.ENGINEERING FRACTURE MECHANICS,78([db:dc_citation_issue]),2935-2946.
MLA	Yan, Yabin,et al."Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components".ENGINEERING FRACTURE MECHANICS 78.[db:dc_citation_issue](2011):2935-2946.

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