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	Thermoelastic behavior of interface of composite plate under thermal shock
	Xiong, Qilin; Tian, Xiaogeng; Shen, Yapeng; Xia, Ronghou
刊名	Lixue Xuebao/Chinese Journal of Theoretical and Applied Mechanics
	2011
卷号	43期号:[db:dc_citation_issue]页码:630-634
关键词	Displacement and stress Generalized thermo-elasticity Heat conduction coefficient Laminated plate Material parameter Mechanical parameters Thermal relaxation time Thermo-elastic behavior
ISSN号	0459-1879
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4492953
专题	西安交通大学
推荐引用方式 GB/T 7714	Xiong, Qilin,Tian, Xiaogeng,Shen, Yapeng,et al. Thermoelastic behavior of interface of composite plate under thermal shock[J]. Lixue Xuebao/Chinese Journal of Theoretical and Applied Mechanics,2011,43([db:dc_citation_issue]):630-634.
APA	Xiong, Qilin,Tian, Xiaogeng,Shen, Yapeng,&Xia, Ronghou.(2011).Thermoelastic behavior of interface of composite plate under thermal shock.Lixue Xuebao/Chinese Journal of Theoretical and Applied Mechanics,43([db:dc_citation_issue]),630-634.
MLA	Xiong, Qilin,et al."Thermoelastic behavior of interface of composite plate under thermal shock".Lixue Xuebao/Chinese Journal of Theoretical and Applied Mechanics 43.[db:dc_citation_issue](2011):630-634.

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