CORC  > 西安交通大学
Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film
Liu Bo; Yang Jijun; Jiao Guohua; Hu Kewei
刊名PLASMA SCIENCE & TECHNOLOGY
2012
卷号14期号:[db:dc_citation_issue]页码:619-623
关键词thermal stability interfacial adhesion diffusion barrier self-aligned CuSiN process
ISSN号1009-0630
DOI[db:dc_identifier_doi]
URL标识查看原文
WOS记录号[DB:DC_IDENTIFIER_WOSID]
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/4479778
专题西安交通大学
推荐引用方式
GB/T 7714
Liu Bo,Yang Jijun,Jiao Guohua,et al. Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film[J]. PLASMA SCIENCE & TECHNOLOGY,2012,14([db:dc_citation_issue]):619-623.
APA Liu Bo,Yang Jijun,Jiao Guohua,&Hu Kewei.(2012).Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film.PLASMA SCIENCE & TECHNOLOGY,14([db:dc_citation_issue]),619-623.
MLA Liu Bo,et al."Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film".PLASMA SCIENCE & TECHNOLOGY 14.[db:dc_citation_issue](2012):619-623.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace