| Effects of Copper Plating Thickness of Ni/Fe Alloy Leadframe on the Thermal Performance of Small Outline Transistor (SOT) Packages | |
| Li, Weiqiang; Chen, Haibin; Han, Jiale; Xue, Ke; Wong, Fei; Shiu, Ivan; Cheng, Guangxu; Wu, Jingshen | |
| 2012 | |
| 期号 | [db:dc_citation_issue] |
| DOI | [db:dc_identifier_doi] |
| 页码 | 384-387 |
| 会议录 | 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)
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| URL标识 | 查看原文 |
| ISSN号 | 9781467316804 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4472305 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Li, Weiqiang,Chen, Haibin,Han, Jiale,et al. Effects of Copper Plating Thickness of Ni/Fe Alloy Leadframe on the Thermal Performance of Small Outline Transistor (SOT) Packages[C]. 见:. |
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