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	Effects of Copper Plating Thickness of Ni/Fe Alloy Leadframe on Thermo-Mechanical and Die Cracking Behaviors of Small Outline Transistor (SOT) Packages
	Li, Weiqiang; Chen, Haibin; Han, Jiale; Xue, Ke; Wong, Fei; Shiu, Ivan; Cheng, Guangxu; Wu, Jingshen
刊名	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
	2013
卷号	3期号:[db:dc_citation_issue]页码:1713-1719
关键词	Copper plating die cracking thermal resistance
ISSN号	2156-3950
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4449094
专题	西安交通大学
推荐引用方式 GB/T 7714	Li, Weiqiang,Chen, Haibin,Han, Jiale,et al. Effects of Copper Plating Thickness of Ni/Fe Alloy Leadframe on Thermo-Mechanical and Die Cracking Behaviors of Small Outline Transistor (SOT) Packages[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2013,3([db:dc_citation_issue]):1713-1719.
APA	Li, Weiqiang.,Chen, Haibin.,Han, Jiale.,Xue, Ke.,Wong, Fei.,...&Wu, Jingshen.(2013).Effects of Copper Plating Thickness of Ni/Fe Alloy Leadframe on Thermo-Mechanical and Die Cracking Behaviors of Small Outline Transistor (SOT) Packages.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,3([db:dc_citation_issue]),1713-1719.
MLA	Li, Weiqiang,et al."Effects of Copper Plating Thickness of Ni/Fe Alloy Leadframe on Thermo-Mechanical and Die Cracking Behaviors of Small Outline Transistor (SOT) Packages".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 3.[db:dc_citation_issue](2013):1713-1719.

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