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	Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling
	Xie, Gongnan; Liu, Jian; Liu, Yanquan; Sunden, Bengt; Zhang, Weihong
刊名	JOURNAL OF ELECTRONIC PACKAGING
	2013
卷号	135期号:[db:dc_citation_issue]
关键词	laminar heat transfer liquid cooling wavy microchannel simulation
ISSN号	1043-7398
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4445066
专题	西安交通大学
推荐引用方式 GB/T 7714	Xie, Gongnan,Liu, Jian,Liu, Yanquan,et al. Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling[J]. JOURNAL OF ELECTRONIC PACKAGING,2013,135([db:dc_citation_issue]).
APA	Xie, Gongnan,Liu, Jian,Liu, Yanquan,Sunden, Bengt,&Zhang, Weihong.(2013).Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling.JOURNAL OF ELECTRONIC PACKAGING,135([db:dc_citation_issue]).
MLA	Xie, Gongnan,et al."Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling".JOURNAL OF ELECTRONIC PACKAGING 135.[db:dc_citation_issue](2013).

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