The method research of non-contact thickness measurement of transparent object with free-form surface

	The method research of non-contact thickness measurement of transparent object with free-form surface
	Wang W(王巍); Dong ZL(董再励); Liu ZY(刘长有)
	2004
会议名称	5th World Congress on Intelligent Control and Automation
会议日期	June 15-19, 2004
会议地点	Hangzhou, China
页码	3837-3841
中文摘要	This paper presents the method and algorithm for surface 3D information and thickness measurement of the free-form transparent objects. The measurement method based, on the principle of structure light. The analysis of the structure light was represented and the experiment results were given. The validity of the method was proved in this paper.
收录类别	EI
产权排序	1
会议主办者	IEEE
会议录	Proceedings of the World Congress on Intelligent Control and Automation (WCICA)
会议录出版者	IEEE
会议录出版地	New York
语种	英语
内容类型	会议论文
源URL	[http://ir.sia.cn/handle/173321/8909]
专题	沈阳自动化研究所_机器人学研究室
推荐引用方式 GB/T 7714	Wang W,Dong ZL,Liu ZY. The method research of non-contact thickness measurement of transparent object with free-form surface[C]. 见:5th World Congress on Intelligent Control and Automation. Hangzhou, China. June 15-19, 2004.