| Microstructure and Mechanical Properties of Al/Sn-Zn-X/Cu Solder Joints | |
| Liu, Jiaxi; Huang, Mingliang; Zhao, Ning; Zhang, Liwen | |
| 2015 | |
| 会议名称 | 16 int conf elect packaging technology |
| 会议日期 | 2015-08-11 |
| 会议地点 | Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA |
| 关键词 | Al-Cu solder joint Sn-Zn-X solder micrstructure mechanical property electrochemical corrosion behavior |
| 页码 | 1267-1270 |
| 会议录 | 16 int conf elect packaging technology
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4408428 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Lab Elect Packaging Mat, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Liu, Jiaxi,Huang, Mingliang,Zhao, Ning,et al. Microstructure and Mechanical Properties of Al/Sn-Zn-X/Cu Solder Joints[C]. 见:16 int conf elect packaging technology. Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA. 2015-08-11. |
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