| Micro Heatpipe Integrated with LED Silicon Substrate | |
| Luo, Yi; Yu, Beike; Zhou, Chuanpeng; Wang, Xiaodong | |
| 2015 | |
| 会议名称 | 16 int conf elect packaging technology |
| 会议日期 | 2015-08-11 |
| 会议地点 | Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA |
| 关键词 | high-power LED thermal interface micro heat pipe micro heat sink |
| 页码 | 85-88 |
| 会议录 | 16 int conf elect packaging technology
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4408418 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116023, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Luo, Yi,Yu, Beike,Zhou, Chuanpeng,et al. Micro Heatpipe Integrated with LED Silicon Substrate[C]. 见:16 int conf elect packaging technology. Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA. 2015-08-11. |
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