A Multi-Scale Study on Silicon-Oxide Etching Processes in C4F8/Ar Plasmas | |
Sui Jiaxing; Zhang Saiqian; Liu Zeng; Yan Jun; Dai Zhongling | |
刊名 | PLASMA SCIENCE & TECHNOLOGY |
2016 | |
卷号 | 18页码:666-673 |
关键词 | plasma etching multi-scale model trench profile surface process |
ISSN号 | 1009-0630 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4368380 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian Univ Technol, Sch Phys & Optoelect Technol, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Dept Engn Mech, Dalian 116024, Peoples R China. |
推荐引用方式 GB/T 7714 | Sui Jiaxing,Zhang Saiqian,Liu Zeng,et al. A Multi-Scale Study on Silicon-Oxide Etching Processes in C4F8/Ar Plasmas[J]. PLASMA SCIENCE & TECHNOLOGY,2016,18:666-673. |
APA | Sui Jiaxing,Zhang Saiqian,Liu Zeng,Yan Jun,&Dai Zhongling.(2016).A Multi-Scale Study on Silicon-Oxide Etching Processes in C4F8/Ar Plasmas.PLASMA SCIENCE & TECHNOLOGY,18,666-673. |
MLA | Sui Jiaxing,et al."A Multi-Scale Study on Silicon-Oxide Etching Processes in C4F8/Ar Plasmas".PLASMA SCIENCE & TECHNOLOGY 18(2016):666-673. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论