Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing | |
Yan, Shiwei; Lei, Yu; Huang, Shangyu; Wang, Qiong; Zhou, Mengcheng; Hu, Jianhua; Zou, Fangli | |
刊名 | International Journal of Applied Electromagnetics and Mechanics
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2019 | |
卷号 | 60期号:3 |
ISSN号 | 1383-5416 |
DOI | 10.3233/JAE-180021 |
URL标识 | 查看原文 |
收录类别 | EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4243465 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Yan, Shiwei,Lei, Yu,Huang, Shangyu,et al. Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing[J]. International Journal of Applied Electromagnetics and Mechanics,2019,60(3). |
APA | Yan, Shiwei.,Lei, Yu.,Huang, Shangyu.,Wang, Qiong.,Zhou, Mengcheng.,...&Zou, Fangli.(2019).Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing.International Journal of Applied Electromagnetics and Mechanics,60(3). |
MLA | Yan, Shiwei,et al."Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing".International Journal of Applied Electromagnetics and Mechanics 60.3(2019). |
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