| Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing | |
| Yan, Shiwei; Lei, Yu; Huang, Shangyu; Wang, Qiong; Zhou, Mengcheng; Hu, Jianhua; Zou, Fangli | |
| 刊名 | International Journal of Applied Electromagnetics and Mechanics
 |
| 2019 | |
| 卷号 | 60期号:3 |
| ISSN号 | 1383-5416 |
| DOI | 10.3233/JAE-180021 |
| URL标识 | 查看原文 |
| 收录类别 | EI |
| 语种 | 英语 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4243465 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Yan, Shiwei,Lei, Yu,Huang, Shangyu,et al. Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing[J]. International Journal of Applied Electromagnetics and Mechanics,2019,60(3). |
| APA | Yan, Shiwei.,Lei, Yu.,Huang, Shangyu.,Wang, Qiong.,Zhou, Mengcheng.,...&Zou, Fangli.(2019).Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing.International Journal of Applied Electromagnetics and Mechanics,60(3). |
| MLA | Yan, Shiwei,et al."Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing".International Journal of Applied Electromagnetics and Mechanics 60.3(2019). |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论