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	Flow boiling performance in pin fin- interconnected reentrant microchannels heat sink in different operational conditions
	Deng, Daxiang; Chen, Liang; Wan, Wei; Fu, Ting; Huang, Xiang
刊名	Applied Thermal Engineering
	2019
卷号	150
ISSN号	1359-4311
DOI	10.1016/j.applthermaleng.2019.01.092
URL标识	查看原文
收录类别	EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4239793
专题	武汉大学
推荐引用方式 GB/T 7714	Deng, Daxiang,Chen, Liang,Wan, Wei,et al. Flow boiling performance in pin fin- interconnected reentrant microchannels heat sink in different operational conditions[J]. Applied Thermal Engineering,2019,150.
APA	Deng, Daxiang,Chen, Liang,Wan, Wei,Fu, Ting,&Huang, Xiang.(2019).Flow boiling performance in pin fin- interconnected reentrant microchannels heat sink in different operational conditions.Applied Thermal Engineering,150.
MLA	Deng, Daxiang,et al."Flow boiling performance in pin fin- interconnected reentrant microchannels heat sink in different operational conditions".Applied Thermal Engineering 150(2019).

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