Flow boiling performance in pin fin- interconnected reentrant microchannels heat sink in different operational conditions | |
Deng, Daxiang; Chen, Liang; Wan, Wei; Fu, Ting; Huang, Xiang | |
刊名 | Applied Thermal Engineering
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2019 | |
卷号 | 150 |
ISSN号 | 1359-4311 |
DOI | 10.1016/j.applthermaleng.2019.01.092 |
URL标识 | 查看原文 |
收录类别 | EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4239793 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Deng, Daxiang,Chen, Liang,Wan, Wei,et al. Flow boiling performance in pin fin- interconnected reentrant microchannels heat sink in different operational conditions[J]. Applied Thermal Engineering,2019,150. |
APA | Deng, Daxiang,Chen, Liang,Wan, Wei,Fu, Ting,&Huang, Xiang.(2019).Flow boiling performance in pin fin- interconnected reentrant microchannels heat sink in different operational conditions.Applied Thermal Engineering,150. |
MLA | Deng, Daxiang,et al."Flow boiling performance in pin fin- interconnected reentrant microchannels heat sink in different operational conditions".Applied Thermal Engineering 150(2019). |
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