| Studies on Contact Degradation Process and Failure Mechanism of GIB Plug-In Connector | |
| Guan, Xiangyu; Qin, Jingshu; Shu, Naiqiu; Peng, Hui | |
| 刊名 | IEEE Transactions on Components, Packaging and Manufacturing Technology
 |
| 2019 | |
| 卷号 | 9期号:9 |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2019.2930415 |
| URL标识 | 查看原文 |
| 收录类别 | EI |
| 语种 | 英语 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4239566 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Guan, Xiangyu,Qin, Jingshu,Shu, Naiqiu,et al. Studies on Contact Degradation Process and Failure Mechanism of GIB Plug-In Connector[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2019,9(9). |
| APA | Guan, Xiangyu,Qin, Jingshu,Shu, Naiqiu,&Peng, Hui.(2019).Studies on Contact Degradation Process and Failure Mechanism of GIB Plug-In Connector.IEEE Transactions on Components, Packaging and Manufacturing Technology,9(9). |
| MLA | Guan, Xiangyu,et al."Studies on Contact Degradation Process and Failure Mechanism of GIB Plug-In Connector".IEEE Transactions on Components, Packaging and Manufacturing Technology 9.9(2019). |
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