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	Correlation characteristics between SF6 decomposition process and partial discharge quantity under negative DC condition initiated by free metal particle defect
	Yang, Dong; Tang, Ju; Zeng, Fuping; Yang, Xu; Yao, Qiang; Miao, Yulong; Chen, Lincong
刊名	IEEE Transactions on Dielectrics and Electrical Insulation
	2018
卷号	25期号:2
ISSN号	1070-9878
DOI	10.1109/TDEI.2018.006684
URL标识	查看原文
收录类别	EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4236264
专题	武汉大学
推荐引用方式 GB/T 7714	Yang, Dong,Tang, Ju,Zeng, Fuping,et al. Correlation characteristics between SF6 decomposition process and partial discharge quantity under negative DC condition initiated by free metal particle defect[J]. IEEE Transactions on Dielectrics and Electrical Insulation,2018,25(2).
APA	Yang, Dong.,Tang, Ju.,Zeng, Fuping.,Yang, Xu.,Yao, Qiang.,...&Chen, Lincong.(2018).Correlation characteristics between SF6 decomposition process and partial discharge quantity under negative DC condition initiated by free metal particle defect.IEEE Transactions on Dielectrics and Electrical Insulation,25(2).
MLA	Yang, Dong,et al."Correlation characteristics between SF6 decomposition process and partial discharge quantity under negative DC condition initiated by free metal particle defect".IEEE Transactions on Dielectrics and Electrical Insulation 25.2(2018).

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