Direct ink writing of 3D cavities for direct plated copper ceramic substrates with kaolin suspensions | |
Sun, Qinglei; Peng, Yang; Cheng, Hao; Mou, Yun; Yang, Zizhou; Liang, Dandan; Chen, Mingxiang | |
刊名 | Ceramics International
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2019 | |
卷号 | 45期号:9 |
ISSN号 | 0272-8842 |
DOI | 10.1016/j.ceramint.2019.03.191 |
URL标识 | 查看原文 |
收录类别 | EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4231346 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Sun, Qinglei,Peng, Yang,Cheng, Hao,et al. Direct ink writing of 3D cavities for direct plated copper ceramic substrates with kaolin suspensions[J]. Ceramics International,2019,45(9). |
APA | Sun, Qinglei.,Peng, Yang.,Cheng, Hao.,Mou, Yun.,Yang, Zizhou.,...&Chen, Mingxiang.(2019).Direct ink writing of 3D cavities for direct plated copper ceramic substrates with kaolin suspensions.Ceramics International,45(9). |
MLA | Sun, Qinglei,et al."Direct ink writing of 3D cavities for direct plated copper ceramic substrates with kaolin suspensions".Ceramics International 45.9(2019). |
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