| Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics | |
| Wang, Miaocao; Zhu, Fulong; Xu, Yixin; Liu, Sheng | |
| 2018 | |
| DOI | 10.23919/ICEP.2018.8374341 |
| 收录类别 | EI |
| 会议录 | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
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| 语种 | 英语 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4227235 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Wang, Miaocao,Zhu, Fulong,Xu, Yixin,et al. Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics[C]. 见:. |
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