An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment | |
Shu, Xi; Liu, Huiqin; Zhu, Yezi; Cai, Bo; Jin, Yanxia; Wei, Yongchang; Zhou, Fuling; Liu, Wei; Guo, Shishang | |
刊名 | MICROFLUIDICS AND NANOFLUIDICS
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2018 | |
卷号 | 22期号:3 |
关键词 | BAWs chip PDMS layer Spin-coating Oxygen plasma treating Standing wave field |
ISSN号 | 1613-4982 |
DOI | 10.1007/s10404-018-2052-6 |
URL标识 | 查看原文 |
收录类别 | SCIE ; EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4214345 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Shu, Xi,Liu, Huiqin,Zhu, Yezi,et al. An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment[J]. MICROFLUIDICS AND NANOFLUIDICS,2018,22(3). |
APA | Shu, Xi.,Liu, Huiqin.,Zhu, Yezi.,Cai, Bo.,Jin, Yanxia.,...&Guo, Shishang.(2018).An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment.MICROFLUIDICS AND NANOFLUIDICS,22(3). |
MLA | Shu, Xi,et al."An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment".MICROFLUIDICS AND NANOFLUIDICS 22.3(2018). |
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