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	An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment
	Shu, Xi; Liu, Huiqin; Zhu, Yezi; Cai, Bo; Jin, Yanxia; Wei, Yongchang; Zhou, Fuling; Liu, Wei; Guo, Shishang
刊名	MICROFLUIDICS AND NANOFLUIDICS
	2018
卷号	22期号:3
关键词	BAWs chip PDMS layer Spin-coating Oxygen plasma treating Standing wave field
ISSN号	1613-4982
DOI	10.1007/s10404-018-2052-6
URL标识	查看原文
收录类别	SCIE ; EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4214345
专题	武汉大学
推荐引用方式 GB/T 7714	Shu, Xi,Liu, Huiqin,Zhu, Yezi,et al. An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment[J]. MICROFLUIDICS AND NANOFLUIDICS,2018,22(3).
APA	Shu, Xi.,Liu, Huiqin.,Zhu, Yezi.,Cai, Bo.,Jin, Yanxia.,...&Guo, Shishang.(2018).An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment.MICROFLUIDICS AND NANOFLUIDICS,22(3).
MLA	Shu, Xi,et al."An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment".MICROFLUIDICS AND NANOFLUIDICS 22.3(2018).

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