Study on the grinding kinetics of copper tailing powder | |
Liu, Shuhua; Li, Qiaoling; Song, Junwei | |
刊名 | POWDER TECHNOLOGY
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2018 | |
卷号 | 330 |
关键词 | Copper tailing powder Grinding kinetics Kinetic equation Distribution model Fractal theory Grey correlational analysis |
ISSN号 | 0032-5910 |
DOI | 10.1016/j.powtec.2018.02.025 |
URL标识 | 查看原文 |
收录类别 | SCIE ; EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4213332 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Liu, Shuhua,Li, Qiaoling,Song, Junwei. Study on the grinding kinetics of copper tailing powder[J]. POWDER TECHNOLOGY,2018,330. |
APA | Liu, Shuhua,Li, Qiaoling,&Song, Junwei.(2018).Study on the grinding kinetics of copper tailing powder.POWDER TECHNOLOGY,330. |
MLA | Liu, Shuhua,et al."Study on the grinding kinetics of copper tailing powder".POWDER TECHNOLOGY 330(2018). |
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