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Study on the grinding kinetics of copper tailing powder
Liu, Shuhua; Li, Qiaoling; Song, Junwei
刊名POWDER TECHNOLOGY
2018
卷号330
关键词Copper tailing powder Grinding kinetics Kinetic equation Distribution model Fractal theory Grey correlational analysis
ISSN号0032-5910
DOI10.1016/j.powtec.2018.02.025
URL标识查看原文
收录类别SCIE ; EI
语种英语
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/4213332
专题武汉大学
推荐引用方式
GB/T 7714
Liu, Shuhua,Li, Qiaoling,Song, Junwei. Study on the grinding kinetics of copper tailing powder[J]. POWDER TECHNOLOGY,2018,330.
APA Liu, Shuhua,Li, Qiaoling,&Song, Junwei.(2018).Study on the grinding kinetics of copper tailing powder.POWDER TECHNOLOGY,330.
MLA Liu, Shuhua,et al."Study on the grinding kinetics of copper tailing powder".POWDER TECHNOLOGY 330(2018).
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