Creep behavior of cold-rolled nanocrystalline pure copper

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	Creep behavior of cold-rolled nanocrystalline pure copper
	B. Cai ; Q. P. Kong ; P. Cui ; L. Lu ; K. Lu
刊名	Scripta Materialia
	2001
卷号	45 期号:12 页码:1407-1413
关键词	creep nanocrystalline copper cold rolling grain boundary diffusional creep temperature creep grain-boundaries room-temperature superplasticity deformation
ISSN号	1359-6462
中文摘要	The creep of cold rolled nanocrystalline Cu has been investigated at 20-50 degreesC. The most reasonable stress exponent is found to be 2, the corresponding activation energy is 0.82 eV. The results imply that the creep is possibly associated with grain boundary sliding. The increase of threshold stress after rolling is associated with the increase of microstrain. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
原文出处	://WOS:000173555500012
公开日期	2012-04-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/36600]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	B. Cai,Q. P. Kong,P. Cui,et al. Creep behavior of cold-rolled nanocrystalline pure copper[J]. Scripta Materialia,2001,45(12):1407-1413.
APA	B. Cai,Q. P. Kong,P. Cui,L. Lu,&K. Lu.(2001).Creep behavior of cold-rolled nanocrystalline pure copper.Scripta Materialia,45(12),1407-1413.
MLA	B. Cai,et al."Creep behavior of cold-rolled nanocrystalline pure copper".Scripta Materialia 45.12(2001):1407-1413.