Recrystallization in fatigued copper single crystals under electropulsing

CORC > 金属研究所 > 中国科学院金属研究所

	Recrystallization in fatigued copper single crystals under electropulsing
	S. H. Xiao ; J. D. Guo ; S. D. Wu ; G. H. He ; S. X. Li
刊名	Scripta Materialia
	2002
卷号	46 期号:1 页码:40914
关键词	copper fatigue electropulsing nucleation recrystallization electric-current pulses behavior metals
ISSN号	1359-6462
中文摘要	Fatigued copper single crystal was treated by electropulsing, it leads to the formation of two kinds of recrystallized grain with finer-grain size, Due to the homogeneous distribution of the vein structures, the recrystallized grains formed in this region have no preferential direction. However, the recrystallized grains formed around persistent slip bands show bigger grain size along slip direction. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
原文出处	://WOS:000175333000001
公开日期	2012-04-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/36468]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	S. H. Xiao,J. D. Guo,S. D. Wu,et al. Recrystallization in fatigued copper single crystals under electropulsing[J]. Scripta Materialia,2002,46(1):40914.
APA	S. H. Xiao,J. D. Guo,S. D. Wu,G. H. He,&S. X. Li.(2002).Recrystallization in fatigued copper single crystals under electropulsing.Scripta Materialia,46(1),40914.
MLA	S. H. Xiao,et al."Recrystallization in fatigued copper single crystals under electropulsing".Scripta Materialia 46.1(2002):40914.