Contact Resistance Model and Thermal Stability Analysis of Bolt Structure | |
Wu, Yongcong; Ruan, Jiangjun; Gong, Yujia; Long, Mingyang; Li, Peng | |
刊名 | IEEE Transactions on Components, Packaging and Manufacturing Technology
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2018 | |
ISSN号 | 2156-3950 |
DOI | 10.1109/TCPMT.2018.2877774 |
URL标识 | 查看原文 |
收录类别 | EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4153184 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Wu, Yongcong,Ruan, Jiangjun,Gong, Yujia,et al. Contact Resistance Model and Thermal Stability Analysis of Bolt Structure[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2018. |
APA | Wu, Yongcong,Ruan, Jiangjun,Gong, Yujia,Long, Mingyang,&Li, Peng.(2018).Contact Resistance Model and Thermal Stability Analysis of Bolt Structure.IEEE Transactions on Components, Packaging and Manufacturing Technology. |
MLA | Wu, Yongcong,et al."Contact Resistance Model and Thermal Stability Analysis of Bolt Structure".IEEE Transactions on Components, Packaging and Manufacturing Technology (2018). |
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