Effect of grain boundary on the wettability and interfacial morphology in the molten Bi/Cu system

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	Effect of grain boundary on the wettability and interfacial morphology in the molten Bi/Cu system
	Q. G. Xu ; H. F. Zhang ; B. Z. Ding ; Z. Q. Hu
刊名	Journal of Materials Science & Technology
	2003
卷号	19 期号:3 页码:206-208
关键词	wettability dissolution grain boundary interface equilibrium metals bi
ISSN号	1005-0302
中文摘要	The wetting behavior of molten Bi on polycrystalline Cu substrate and single crystal Cu substrate was studied by the sessile drop method in the temperature range from 673 to 873 K. At low temperature the wetting behaviors of molten Bi on both types of Cu substrate were similar. However, at high temperature, the equilibrium contact angle of polycrystalline Cu substrate was lower than that of single crystal Cu substrate, because the preferred dissolution of grain boundaries leads to a smaller liquid/solid interfacial energy for polycrystalline Cu substrate. The formation mechanism of arrow-shaped Cu grains at the Bi/single crystal Cu interface is also discussed.
原文出处	://WOS:000183282000004
公开日期	2012-04-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/36096]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. G. Xu,H. F. Zhang,B. Z. Ding,et al. Effect of grain boundary on the wettability and interfacial morphology in the molten Bi/Cu system[J]. Journal of Materials Science & Technology,2003,19(3):206-208.
APA	Q. G. Xu,H. F. Zhang,B. Z. Ding,&Z. Q. Hu.(2003).Effect of grain boundary on the wettability and interfacial morphology in the molten Bi/Cu system.Journal of Materials Science & Technology,19(3),206-208.
MLA	Q. G. Xu,et al."Effect of grain boundary on the wettability and interfacial morphology in the molten Bi/Cu system".Journal of Materials Science & Technology 19.3(2003):206-208.