Origin of cracking in nanoscale Cu/Ta multilayers

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	Origin of cracking in nanoscale Cu/Ta multilayers
	G. P. Zhang ; X. F. Zhu ; J. Tan ; Y. Liu
刊名	Applied Physics Letters
	2006
卷号	89 期号:4
关键词	mechanical-properties thin-films strength fracture copper
ISSN号	0003-6951
中文摘要	Cracking behaviors in nanoscale Cu/Ta multilayers bonded to polyimide substrates have been investigated by uniaxial tensile tests. Experimental results show that cracks originate from the localized deformation regions associated with aligned grain boundaries. Microscopical observations suggest that the alignment of the grain boundaries is caused by local grain boundary sliding and grain rotation, which resulted in the in-plane and out-of-plane cooperative movements of the grains in the multilayers. From the localized damage regions, shear fracture in the through-thickness direction occurred in the nanoscale Cu/Ta multilayer.
原文出处	://WOS:000239376500053
公开日期	2012-04-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/34681]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	G. P. Zhang,X. F. Zhu,J. Tan,et al. Origin of cracking in nanoscale Cu/Ta multilayers[J]. Applied Physics Letters,2006,89(4).
APA	G. P. Zhang,X. F. Zhu,J. Tan,&Y. Liu.(2006).Origin of cracking in nanoscale Cu/Ta multilayers.Applied Physics Letters,89(4).
MLA	G. P. Zhang,et al."Origin of cracking in nanoscale Cu/Ta multilayers".Applied Physics Letters 89.4(2006).