Fatigue and thermal fatigue damage analysis of thin metal films

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	Fatigue and thermal fatigue damage analysis of thin metal films
	G. P. Zhang ; C. A. Volkert ; R. Schwaiger ; R. Monig ; O. Kraft
刊名	Microelectronics Reliability
	2007
卷号	47 期号:12 页码:2007-2013
关键词	high-cycle fatigue copper-films mechanical-properties behavior size deformation specimens tension
ISSN号	0026-2714
中文摘要	In this paper, we summarize several testing methods that are currently available for the characterization of fatigue properties of thin metal films. Using these testing methods, a number of experimental investigations of the fatigue and thermal fatigue of metal films with thicknesses ranging from micrometers to sub-micrometers are described. Extensive experimental observations as well as theoretical analyses reveal that the damage behavior, i.e. typical fatigue extrusions and cracking, are quite different from that of bulk materials, and are controlled by the length scales of the materials. Due to the high surface to volume ratio of thin films interface-induced and diffusion-related damage are prevalent in these small length scale materials. As a result, interfaces pose a serious threat to the reliability of thin films. (c) 2007 Elsevier Ltd. All rights reserved.
原文出处	://WOS:000251484000020
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/34021]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	G. P. Zhang,C. A. Volkert,R. Schwaiger,et al. Fatigue and thermal fatigue damage analysis of thin metal films[J]. Microelectronics Reliability,2007,47(12):2007-2013.
APA	G. P. Zhang,C. A. Volkert,R. Schwaiger,R. Monig,&O. Kraft.(2007).Fatigue and thermal fatigue damage analysis of thin metal films.Microelectronics Reliability,47(12),2007-2013.
MLA	G. P. Zhang,et al."Fatigue and thermal fatigue damage analysis of thin metal films".Microelectronics Reliability 47.12(2007):2007-2013.