On interface strengthening ability in metallic multilayers

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	On interface strengthening ability in metallic multilayers
	Y. P. Li ; G. P. Zhang ; W. Wang ; J. Tan ; S. J. Zhu
刊名	Scripta Materialia
	2007
卷号	57 期号:2 页码:117-120
关键词	multilayer yield strength interface dislocation mechanical-properties thin-films epitaxial multilayers misfit dislocations analytic treatment length scales composites deformation defects cu
ISSN号	1359-6462
中文摘要	The strength of Cu/Au multilayers with different individual layer thicknesses (),) from 25 to 250 nm has been investigated by nanoindentation testing. It is found that the increase in strength of the Cu/Au multilayers with decreasing). follows the Hall-Petch relation until 1 is less than 50 nm. Based on the concept of lattice mismatch, a simple model is proposed to describe interface strengthening ability in metallic multilayers found here and reported in the literature. (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
原文出处	://WOS:000247059800012
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/33669]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. P. Li,G. P. Zhang,W. Wang,et al. On interface strengthening ability in metallic multilayers[J]. Scripta Materialia,2007,57(2):117-120.
APA	Y. P. Li,G. P. Zhang,W. Wang,J. Tan,&S. J. Zhu.(2007).On interface strengthening ability in metallic multilayers.Scripta Materialia,57(2),117-120.
MLA	Y. P. Li,et al."On interface strengthening ability in metallic multilayers".Scripta Materialia 57.2(2007):117-120.